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Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

ব্র্যান্ড নাম: rmi
মডেল নম্বর: X-7900
MOQ: 1
দাম: US$ 23000
প্যাকেজিংয়ের বিবরণ: উডডেন বক্স
অর্থ প্রদানের শর্তাবলী: টি/টি
বিস্তারিত তথ্য
উৎপত্তি স্থল:
গুয়াংডং, চীন
সাক্ষ্যদান:
CE
ওজন:
1050 কেজি
ভোল্টেজ:
AC110-220V 50-60Hz
স্থানিক রেজল্যুশন:
3 μm
টিউব ভোল্টেজ:
130kV
টিউব কারেন্ট:
300μa
ইমেজিং নির্ভুলতা:
ফ্ল্যাট-প্যানেল ডিজিটাল
A/D রূপান্তর ঘনত্ব:
16বিট (65536)
ডিপিআই:
1536*1536px
ফ্রেম ফ্রিকোয়েন্সি:
20 fps
অপটিক্যাল ম্যাগনিফিকেশন:
450X
সিস্টেম ম্যাগনিফিকেশন:
2000X
শক্তি:
1200W
মেশিনের আকার:
L1098 x W1389 x H2157 মিমি
যোগানের ক্ষমতা:
1000 ইউনিট / মাস
বিশেষভাবে তুলে ধরা:

3um Accuracy X-Ray Inspection System

,

2000X Magnification X-Ray Tester

,

PCB BGA Lithium Battery Testing X-Ray Testing Equipment

পণ্যের বর্ণনা
Ultra High Precision X-7900 2000X X-Ray Inspection System SMT X-Ray Inspection Machine

The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.

Key Features

Advanced Imaging Technology

  • 2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.

  • Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.

Flexible Operation Modes

  • Manual mode for R&D and failure analysis.

  • Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).

Precision Manipulation

  • 5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.

User-Friendly Software

  • Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.

  • Data export for SPC (statistical process control) and traceability.

Compact & Benchtop Options

  • Space-saving benchtop design available for laboratories and low-volume assembly.

  • Inline conveyor type for fully automated SMT lines.

Technical Specifications
Model X-7900
Tube Type Enclosed Type
Spatial Resolution 3 μm
Tube Voltage 130kV
Tube Current 300μA
Image Taking Type Flat-panel Digital
Imaging Precision 85μm
A/D Convert Quantified Density Value 16bit (65536)
DPI 1536*1536px
Frame Frequency 20 FPS
Optical Magnification 450X
System Magnification 2000X
Operating System Windows 11
Power Supply AC110-220V 50-60HZ
Power Consumption 1200W
Radiation Safety Test <1 μSV/H
Detector Rotation Angle 60°
Stage Size 540*540mm
Sensing Range 510*510mm
Load-bearing Capacity ≤10kg
Machine Size 1098*1389*2157mm (L*W*H)
Machine Size (Including Monitor) 1601*1920*2157mm (L*W*H)
Machine Weight 1050kg
Stage Movement Automatic / Manual
Applications
  • PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.

  • Semiconductor: Die attach, wire bonding, and void detection in power modules.

  • Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.

  • Medical Devices: High-reliability component inspection.

  • R&D & Failure Analysis: Root cause analysis of soldering defects.

Why Choose This SMT X-Ray Tester?
  • Reduce rework costs by catching hidden defects early.

  • Increase throughput with automated inspection routines.

  • Meet industry standards (IPC-A-610, ISO 9001).

  • Global support with CE, FCC, and ROHS certifications.

Package Includes
  • Main X-ray inspection unit

  • Industrial control PC with pre-installed software

  • Calibration tool kit

  • Operation manual and safety guide

  • One-year warranty and remote technical support

ভালো দাম  অনলাইন

পণ্যের বিবরণ

বাড়ি > পণ্য >
ইলেকট্রনিক্স উৎপাদন যন্ত্রপাতি
>
Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

ব্র্যান্ড নাম: rmi
মডেল নম্বর: X-7900
MOQ: 1
দাম: US$ 23000
প্যাকেজিংয়ের বিবরণ: উডডেন বক্স
অর্থ প্রদানের শর্তাবলী: টি/টি
বিস্তারিত তথ্য
উৎপত্তি স্থল:
গুয়াংডং, চীন
পরিচিতিমুলক নাম:
rmi
সাক্ষ্যদান:
CE
মডেল নম্বার:
X-7900
ওজন:
1050 কেজি
ভোল্টেজ:
AC110-220V 50-60Hz
স্থানিক রেজল্যুশন:
3 μm
টিউব ভোল্টেজ:
130kV
টিউব কারেন্ট:
300μa
ইমেজিং নির্ভুলতা:
ফ্ল্যাট-প্যানেল ডিজিটাল
A/D রূপান্তর ঘনত্ব:
16বিট (65536)
ডিপিআই:
1536*1536px
ফ্রেম ফ্রিকোয়েন্সি:
20 fps
অপটিক্যাল ম্যাগনিফিকেশন:
450X
সিস্টেম ম্যাগনিফিকেশন:
2000X
শক্তি:
1200W
মেশিনের আকার:
L1098 x W1389 x H2157 মিমি
ন্যূনতম চাহিদার পরিমাণ:
1
মূল্য:
US$ 23000
প্যাকেজিং বিবরণ:
উডডেন বক্স
ডেলিভারি সময়:
10-15 দিন
পরিশোধের শর্ত:
টি/টি
যোগানের ক্ষমতা:
1000 ইউনিট / মাস
বিশেষভাবে তুলে ধরা:

3um Accuracy X-Ray Inspection System

,

2000X Magnification X-Ray Tester

,

PCB BGA Lithium Battery Testing X-Ray Testing Equipment

পণ্যের বর্ণনা
Ultra High Precision X-7900 2000X X-Ray Inspection System SMT X-Ray Inspection Machine

The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.

Key Features

Advanced Imaging Technology

  • 2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.

  • Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.

Flexible Operation Modes

  • Manual mode for R&D and failure analysis.

  • Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).

Precision Manipulation

  • 5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.

User-Friendly Software

  • Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.

  • Data export for SPC (statistical process control) and traceability.

Compact & Benchtop Options

  • Space-saving benchtop design available for laboratories and low-volume assembly.

  • Inline conveyor type for fully automated SMT lines.

Technical Specifications
Model X-7900
Tube Type Enclosed Type
Spatial Resolution 3 μm
Tube Voltage 130kV
Tube Current 300μA
Image Taking Type Flat-panel Digital
Imaging Precision 85μm
A/D Convert Quantified Density Value 16bit (65536)
DPI 1536*1536px
Frame Frequency 20 FPS
Optical Magnification 450X
System Magnification 2000X
Operating System Windows 11
Power Supply AC110-220V 50-60HZ
Power Consumption 1200W
Radiation Safety Test <1 μSV/H
Detector Rotation Angle 60°
Stage Size 540*540mm
Sensing Range 510*510mm
Load-bearing Capacity ≤10kg
Machine Size 1098*1389*2157mm (L*W*H)
Machine Size (Including Monitor) 1601*1920*2157mm (L*W*H)
Machine Weight 1050kg
Stage Movement Automatic / Manual
Applications
  • PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.

  • Semiconductor: Die attach, wire bonding, and void detection in power modules.

  • Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.

  • Medical Devices: High-reliability component inspection.

  • R&D & Failure Analysis: Root cause analysis of soldering defects.

Why Choose This SMT X-Ray Tester?
  • Reduce rework costs by catching hidden defects early.

  • Increase throughput with automated inspection routines.

  • Meet industry standards (IPC-A-610, ISO 9001).

  • Global support with CE, FCC, and ROHS certifications.

Package Includes
  • Main X-ray inspection unit

  • Industrial control PC with pre-installed software

  • Calibration tool kit

  • Operation manual and safety guide

  • One-year warranty and remote technical support